Performance with Compatibility
Designed for Perfection
The Limitless Universal Cooler
Patented DirectCompress™ Soldering, increases the actual contact surface between the heatpipe and heatsink fins. DirectCompress™ Soldering has up to 10% more contact surface compared to traditional soldering, and the more contact surface the faster the heat conduction.On aluminum sheets, heat spreads out in a radial direction. By displacing the heatpipe alignment on the heatsink fins, our Heatsink Displacement Optimization™ allows for better and more evenly spread heat conduction on the fins compared to traditional linear alignment.The individual tower stack is separated into two sections, the loose air intake and the high density exhaust section. By the laws of fluid dynamics, the increase in fin count in the exhaust section squeezes airflow and increases exhaust air speed. The increase of airflow speed in our Jet Fin Acceleration System™ allows heated air leave the tower faster.
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Blossom Multimedia – Solusi komputer anda di kota Malang